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Thinksystem Qualcomm Cloud AI 100 - PIE Store · PIE Portal
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Thinksystem Qualcomm Cloud AI 100
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Overview
Specs
Product overview
Lenovo 4X67A84009. Host interface: PCIe, Host interface gender: Male, Expansion card form factor: Low-profile. Purpose: Server, Cooling type: Passive, Certification: International: IEC 62368-1, EN62368-1 2nd, and 3rd Ed. United States of America: FCC Canada:.... Bandwidth: 136.5 Gbit/s. Power consumption (typical): 75 W
Tech specifications
Ports & interfaces
Host interface
PCIe
Host interface gender
Male
Expansion card form factor
Low-profile
Expansion card standard
PCIe 4.0
Design
Internal
Yes
Purpose
Server
Cooling type
Passive
Thinksystem Qualcomm Cloud AI 100
$11,282.29
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Certification
International: IEC 62368-1, EN62368-1 2nd, and 3rd Ed.\nUnited States of America: FCC\nCanada: ICES-003\nEU/UK: EN 55032, EN55024, EN55035, EN 61000-3-2, EN 61000-3-3, EN62368-1 2nd, and 3rd Ed.\nTaiwan: BSMI\nKorea: KN32 / KN35\nJapan: VCCI\nChina: CNS 15663, RoHS\nAustralia / New Zealand: AS/NZS CISPR 32\nLogos: cUL, FCC, ICES, RCM, VCCI
Features
Built-in processor
Yes
Bandwidth
136.5 Gbit/s
Power
Power consumption (typical)
75 W
Operational conditions
Operating temperature (T-T)
0 - 50 °C
Storage temperature (T-T)
-40 - 85 °C
Operating relative humidity (H-H)
5 - 90%
Storage relative humidity (H-H)
5 - 93%
